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ISL6416
Data Sheet November 3, 2004 FN9193.0
Triple Output, Low-Noise LDO Regulator with Integrated Reset Circuit
The ISL6416 is an ultra low noise triple output LDO regulator with microprocessor reset circuit and is optimized for powering wireless chip sets. The IC accepts an input voltage range of 3.0V to 3.6V and provides three regulated output voltages: 1.8V (LDO1), 2.8V (LDO2), and another ultra-clean 2.8V (LDO3). On chip logic provides sequencing between LDO1 and LDO2 for the BBP/MAC and the I/O supply voltage outputs. LDO3 features ultra low noise that does not exceed 30VRMS (typical) to aid VCO stability. High integration makes the ISL6416 an ideal choice to power many of today's small form factor industry standard wireless cards such as PCMCIA, mini-PCI and Cardbus-32. The ISL6416 uses an internal PMOS transistor as the pass device. The ISL6416 also integrates a reset function, which eliminates the need for the additional reset IC required in WLAN applications. The IC asserts a RESET signal whenever the VIN supply voltage drops below a preset threshold, keeping it asserted for at least 25ms after Vin has risen above the reset threshold. FAULT indicates the loss of regulation on LDO1.
Features
* Three LDOs and a RESET circuit * High Output Current - LDO1, 1.8V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 330mA - LDO2, 2.8V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225mA - LDO3, 2.8V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125mA * Low Output Voltage Noise - <30VRMS (typical) for LDO3 (VCO Supply) * Stable with Small Ceramic Output Capacitors * Extensive Protection and Monitoring Features - Overcurrent protection - Short circuit protection - Thermal shutdown - FAULT indicator * Logic-Controlled Shutdown Pin * Integrated Microprocessor Reset Circuit - Programmable Reset Delay * Proven Reference Design for a Total WLAN System Solution * Pb-Free Available (RoHS Compliant)
Ordering Information
PART NUMBER ISL6416IA ISL6416IAZ (Note 1) NOTES: 1. Tape and Reel available. Add "-T" suffix for Tape and Reel Packing Option. 2. Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020C. TEMP. RANGE (C) -40 to +85 -40 to +85 PACKAGE 16 Ld QSOP 16 Ld QSOP (Pb-free) PKG. DWG. # M16.15A M16.15A
Applications
* WLAN Cards - PCMCIA, Cardbus32, MiniPCI Cards - Compact Flash Cards * Hand-Held Instruments
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2004. All Rights Reserved. All Rights Reserved. All other trademarks mentioned are the property of their respective owners.
ISL6416 Pinout and Typical Application Schematic
ISL6416 (QSOP) TOP VIEW
FAULT 1 FAULT 2 NC RESET 3 RESET 4 CT SHDN VOUT3 +2.8V 5 SHDN 6 NC C4 10F 7 VOUT3 C8 0.01F 8 CC3 C7 0.033F VIN 16 VIN 15 VOUT1 14 CC1 13 VOUT2 12 CC2 11 GND 10 GND 9 C6 0.033F C5 0.033F VIN +3.3V VOUT1 +1.8V VOUT2 +2.8V
C1 10F C2 10F C3 10F
Typical Bill Of Materials
REFERENCE DESIGNATOR C1, C2, C3, C4 C5, C6, C7 C8 U1 VALUE 10F, X7R 0.033F, X7R 0.01F, X7R ISL6416IA PACKAGE 1206 0603 0603 QSOP16 MANUFACTURER TDK TDK/ANY TDK/ANY Intersil MANUFACTURER'S PART NUMBER C3216X7R1A106M C1608X7R1A333K C1608X7R1A103K ISL6416IA
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FN9193.0 November 3, 2004
ISL6416 Shrink Small Outline Plastic Packages (SSOP) Quarter Size Outline Plastic Packages (QSOP)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA 0.25 0.010 h x 45 L GAUGE PLANE 0.25(0.010) M BM
M16.15A
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE (0.150" WIDE BODY) INCHES SYMBOL A A1 A2 B C D E
A2 C 0.10(0.004) C AM BS
MILLIMETERS MIN 1.55 0.102 1.40 0.20 0.191 4.80 3.81 5.84 0.25 0.41 16 8 0 8 MAX 1.73 0.249 1.55 0.31 0.249 4.98 3.99 6.20 0.41 0.89 NOTES 9 3 4 5 6 7 Rev. 2 6/04
MIN 0.061 0.004 0.055 0.008 0.0075 0.189 0.150 0.230 0.010 0.016 16 0
MAX 0.068 0.0098 0.061 0.012 0.0098 0.196 0.157 0.244 0.016 0.035
e
B 0.17(0.007) M
A1
e H h L N
0.025 BSC
0.635 BSC
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall be 0.10mm (0.004 inch) total in excess of "B" dimension at maximum material condition. 10. Controlling dimension: INCHES. Converted millimeter dimensions are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 10
FN9193.0 November 3, 2004

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